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Joining and Laminated Object Manufacturing (LOM) of un-welda...
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Deadline: Jan 11, 2024
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Summary

A UK company are the world leading experts in diffusion bonding, achieving flawless bonds between similar and dissimilar materials such as Al, Cu, Ti, Co alloys, Ni superalloys, stainless steels, and semiconductors. The tensile strength is equivalent to parent metals in most cases. Layered objects like compact heat exchangers can be built. Metal parts manufacturers are sought in high value sectors e.g. medical and aerospace sectors, for technical and research cooperation.

Description

Joining of different metals or different alloys of the same metal is highly desirable as different properties of these metals can be combined. There is an increasing demand for components that are lighter yet stronger, that have certain thermal diffusion characteristics and so on. A UK university spinout are leading experts in the field of diffusion bonding. The method can be applied in a very precise manner on small or large objects. The bonds are so smooth the transition cannot be detected often (see attached pictures below). The bonds created this way have been proven on various similar and dissimilar mixtures of aluminium, steel, titanium, Cu, Ni, Co and even semiconductors (for high temperature thermoelectric devices). The smooth transition allows for joints with tensile strength equivalent to parent metals or alloys. The method is also useful for working similar metals within laminated object manufacturing (LOM). For example, heat exchangers can be built in aluminium layer by layer that withstand the enormous temperatures and pressures typical to a jet engine. The UK company is looking for manufacturers of metal parts in high value sectors for research or technical cooperation, dependent on whether a desirable solution already exists or needs to be created. Sectors may include aerospace, medical but also others.

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CASCADE FUNDING OPPORTUNITY - Security-focused demonstration and pilot...

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About CITADEL Open Call 1 The CITADEL Open Call 1 supports security-focused demonstration and pilot projects aimed at strengthening the protection and resilience of critical infrastructures, urban environments, and territories against physical, cyber, and hybrid threats. Projects must validate advanced digital security technologies in real or near-real operational environments, moving from TRL 5–6 to TRL 6–7+. Supported technologies include in particular: • Artificial Intelligence and data analytics (predictive analytics, anomaly detection, decision support, digital twins) • IoT and smart sensing systems (multi-sensor monitoring, edge AI, secure IoT architectures) • Photonics and optical systems (computer vision, advanced sensing, robotics perception) • Cybersecurity solutions (threat detection, secure data management, cyber resilience) • Secure communication and interoperable platforms for crisis coordination and emergency response Funding does not cover technology acquisition, but rather field validation, operational testing, performance measurement (KPIs), and integration within the security value chain to accelerate market uptake.

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